The Ministry of Economic Affairs signed the Service Level Agreement (SLA) to establish Technology and Innovation Support Centers (TISCs) in the country on June 20, 2018. The Hon’ble Tengye Lyonpo graced the signing ceremony as the Chief Guest.

The SLAs were signed at two levels: Hon’ble Tengye Lyonpo signed the SLA on behalf of the Ministry of Economic Affairs with the World Intellectual Property Organization (WIPO). The other SLAs was signed between the Department of Intellectual Property (DoIP) and the three host institutions to establish the TISCs Network. The DoIP will function as a National Focal Point between the WIPO and the three host institutions, namely, the College of Science and Technology, Rinchending, the Jigme Namgyel Engineering College, Dewathang and the Thimphu TechPark Pvt. Limited, Thimphu.

The main objectives of establishing TISCs are to provide innovators and creators with access to high quality scientific and technological information and related services, to help in exploiting the innovative potential and in creating, protecting, and managing Intellectual Property Rights (IPRs).  The establishment of the TISCs is being carried out with assistance of the WIPO through its Development Agenda that calls to facilitate the national IP Offices of the Developing countries to provide access to specialized patent databases and other scientific and technology information.

With signing of the Agreements to establish TISCs, it will facilitate access to technology information to “develop our local proficiency and capabilities for innovation and exploitation, and to work towards full participation in the global knowledge economy”.